The topics of interest for submission include, but are not limited to:
◕ Track 1: Semiconductor materials and process technology
Development of new semiconductor materials
Nanomaterials and Two-dimensional Materials Applications
Characterization technology of semiconductor materials
Crystal growth and material preparation
Material Defects and Interface Engineering
Functional Materials and Composite Materials
Advanced deposition and etching process
Wafer processing and manufacturing technology
Reliability and Failure Analysis of Materials
Application of Material Innovation in Semiconductor Devices
◕ Track 2: Integrated circuit design and manufacturing technology
Advanced process node design method
Low power integrated circuit design
High performance digital and analog circuits
RF and mixed signal integrated circuits
Three-dimensional integration and heterogeneous integration technology
Testing, Validation and Manufacturing Process Control
Chip packaging and interconnection technology
Reliability design of integrated circuits
Quantum devices and future integrated circuits
New integrated circuit architecture
◕ Track 3: Advanced Semiconductor Applications and System Integration
The Application of Semiconductor Devices in Artificial Intelligence
Internet of Things and Intelligent Sensing Systems
Power Electronics and Energy Management Systems
Emerging Semiconductor Devices and Systems
Application of integrated circuit in communication technology
System-on-Chip ( SoC ) design and implementation
Intelligent manufacturing and semiconductor industry automation
The application of semiconductor technology in automotive electronics
Advanced test technology and system verification
Semiconductor industry chain and technology trends