CFP

The topics of interest for submission include, but are not limited to:

◕ Track 1: Semiconductor materials and process technology 

Development of new semiconductor materials 

Nanomaterials and Two-dimensional Materials Applications 

Characterization technology of semiconductor materials 

Crystal growth and material preparation 

Material Defects and Interface Engineering 

Functional Materials and Composite Materials 

Advanced deposition and etching process 

Wafer processing and manufacturing technology 

Reliability and Failure Analysis of Materials 

Application of Material Innovation in Semiconductor Devices

◕ Track 2: Integrated circuit design and manufacturing technology 

Advanced process node design method 

Low power integrated circuit design 

High performance digital and analog circuits 

RF and mixed signal integrated circuits 

Three-dimensional integration and heterogeneous integration technology 

Testing, Validation and Manufacturing Process Control 

Chip packaging and interconnection technology 

Reliability design of integrated circuits 

Quantum devices and future integrated circuits 

New integrated circuit architecture

◕ Track 3: Advanced Semiconductor Applications and System Integration 

The Application of Semiconductor Devices in Artificial Intelligence 

Internet of Things and Intelligent Sensing Systems 

Power Electronics and Energy Management Systems 

Emerging Semiconductor Devices and Systems 

Application of integrated circuit in communication technology 

System-on-Chip ( SoC ) design and implementation 

Intelligent manufacturing and semiconductor industry automation 

The application of semiconductor technology in automotive electronics 

Advanced test technology and system verification 

Semiconductor industry chain and technology trends