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Welcome to SMAICT 2026

2026 International Conference on Semiconductor Materials and Advanced Integrated Circuit Technology

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About

☀ About SMAICT

The 2026 International Conference on Semiconductor Materials and Advanced Integrated Circuit Technology (SMAICT 2026) will be held in Chongqing, China, fromNovember 27to 29, 2026. The conference is sponsored by Chongqing University of Posts and Telecommunications., this conference serves as a premier global event dedicated to advances in semiconductor materials and integrated circuit technology.

With the rapid evolution of semiconductor industries and increasing demands for high-performance, energy-efficient, and miniaturized electronic systems, challenges such as material limitations, device integration complexities, and manufacturing innovation have become critical bottlenecks. Against this backdrop, SMAICT 2026 aims to create a high-level academic and industrial exchange platform to foster cutting-edge research collaboration, bridge gaps between theoretical development and practical applications, and accelerate technological breakthroughs.

The conference will feature keynote speeches, invited talks, oral and poster presentations covering topics including semiconductor materials, device fabrication, integrated circuit design, advanced packaging, and emerging technologies. By bringing together renowned scholars, experts, and industry leaders from universities, research institutions, and enterprises worldwide, SMAICT 2026 will promote interdisciplinary communication and innovation.

SMAICT 2026 is striving for indexing in major databases such as EI Compendex and Scopus and is expected to attract hundreds of participants globally. The conference not only offers a vibrant forum for presenting the latest scientific achievements but also provides opportunities for networking, collaboration, and industry-academia synergy.

We warmly invite researchers, engineers, and industry practitioners worldwide to submit abstracts and manuscripts, participate actively, and contribute to shaping the future of semiconductor materials and integrated circuit technology.
We are pleased to invite you to submit an abstract/manuscripts to present your work in this important scientific event. Previous proceedings were both indexed by EI Compendex and Scopus.

date
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November

27-29, 2026

Conference Dates

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March 3, 2026

Full Paper Submission Date

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November 23, 2026

Registration Deadline

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November9, 2026

Final Paper Submission Date

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CFP

☀ Topics

The topics of interest for submission include, but are not limited to:

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Semiconductor materials and process technology

Development of new semiconductor materials; Nanomaterials and Two-dimensional Materials Applications; Characterization technology of semiconductor materials; Crystal growth and material preparation; Material Defects and Interface Engineering; Functional Materials and Composite Materials; Advanced deposition and etching process; Wafer processing and manufacturing technology; Reliability and Failure Analysis of Materials; Application of Material Innovation in Semiconductor Devices

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Integrated circuit design and manufacturing technology

Advanced process node design method; Low power integrated circuit design; High performance digital and analog circuits; RF and mixed signal integrated circuits; Three-dimensional integration and heterogeneous integration technology; Testing, Validation and Manufacturing Process Control; Chip packaging and interconnection technology; Reliability design of integrated circuits; Quantum devices and future integrated circuits; New integrated circuit architecture

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Advanced Semiconductor Applications and System Integration

The Application of Semiconductor Devices in Artificial Intelligence; Internet of Things and Intelligent Sensing Systems; Power Electronics and Energy Management Systems; Emerging Semiconductor Devices and Systems; Application of integrated circuit in communication technology; System-on-Chip ( SoC ) design and implementation; Intelligent manufacturing and semiconductor industry automation; The application of semiconductor technology in automotive electronics; Advanced test technology and system verification; Semiconductor industry chain and technology trends

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Publication

☀ Publication

All papers submitted to SMAICT 2026 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

Supported by

☀ Host

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